The subsequent parts each cover one of the fundamental building blocks required for microelectronic fabrication. Part 2 addresses hot processing and ion implantation and covers topics including diffusion, thermal oxidation, ion implantation and rapid thermal processing.
Pattern transfer is discussed in part 3 of the text and includes optical lithography, photoresists, non-optical lithographic techniques, etching and vacuum science and plasmas. Part 4 addresses thin films and covers physical decomposition, chemical vapour deposition and epitaxial growth.
The final section of the book, part 5, looks at process integration. The book also contains seven Appendices. Overall this text clearly presents the fundamental parts of a complicated technology. Download for print-disabled. Check nearby libraries Library. Share this book Facebook. November 20, History. Written in English — pages.
Subjects Semiconductors , Design and construction. Not in Library. Libraries near you: WorldCat. The science and engineering of microelectronic fabrication , Oxford University Press. The electronics industry has grown rapidly in the past four decades. Classifications Library of Congress TK C25 Dewey Edition Notes Includes bibliographical references and index. Series Oxford series in electrical engineering.
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